Products
固晶膜
DAF
固晶膜
固晶膜(DAF)是一種超薄的黏合劑，用於半導體封裝過程之中，將半導體芯片連接到電路板或芯片上。
- 黏性極強，固化後晶片不易位移
- 可搭配先進切割製程，如DBG與SDBG
產品結構
產品規格
| Testing Properties of DAF | Testing Data | |||
| Curing Condition of DAF | ||||
| Wafer Mounting Temperature | ℃ | 60~90 | ||
| DAF tape Curing Condition | Thermal cure Temperature | ℃ | 150 | |
| For bonding Chips or substrate | ℃ | |||
其他推薦產品
-
Grinding Tape
研磨膠帶
-
Dicing Tape
切割膠帶
-
Laser Debond Material
雷射解膠膜/液
-
Polyimide Tape
耐高溫膠帶
-
Thermal Release Tape
熱解黏膠帶
-
Material Punch
沖型加工
客製化產品
客製化產品規格
膠帶類客製化規格
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
非膠帶產品客製化規格
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |