Products
雷射解膠膜/液
Laser Debond Material
雷射解膠膜/液
- 解黏前，臨時鍵合膠對晶圓具有極高黏著力，通過雷射又可快速剝離
- 適用雷射波長為355nm/532nm/1064nm
- 常溫即可妥善保存
產品結構
產品規格
| Properties | Unit | Value | |
| Liquid | Thickness | ㎛ | 0.5-1.5 |
| Viscosity | cPs | 50~1,000 | |
| Solid Content | % | 10~50% | |
| Dry Film | Thickness | um | 10~50 |
| Color | Color | - | Black |
| Curing condition | Thermal cure | ℃ x time | 150℃ x 120 mins |
| Heat Resistance Temp. | Max. | ℃ x time | 270℃ x 120 mins |
其他推薦產品
-
Grinding Tape
研磨膠帶
-
Dicing Tape
切割膠帶
-
Die Attach film/DAF
固晶膜
-
Polyimide Tape
耐高溫膠帶
-
Thermal Release Tape
熱解黏膠帶
-
Material Punch
沖型加工
客製化產品
客製化產品規格
膠帶類客製化規格
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
非膠帶產品客製化規格
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |