Products
耐高溫膠帶
Polyimide Tape
耐高溫膠帶
以聚酰亞胺薄膜為基材之膠帶，普及應用於半導體及各產業高溫製程。
- 卓越的耐溫性、耐電壓性以及抗溶劑性
- 可依客戶需求，製作成單、雙面或具有抗靜電功能之膠帶
- 黏性以及厚度皆可量身訂做
產品結構
產品規格
| Product Information | ||
| Base Film Thickness (um) | 12.5 ~ 150 | |
| Adhesive Thickness (um) | 8~120 | |
| Adhesive Strength on SUS (gf/inch) | Acrylic 5~2,000 | Silicone 5~1,000 |
| Heat Resistance Temp. | 10~200 | -20~260 |
其他推薦產品
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Grinding Tape
研磨膠帶
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Dicing Tape
切割膠帶
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Laser Debond Material
雷射解膠膜/液
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Die Attach film/DAF
固晶膜
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Thermal Release Tape
熱解黏膠帶
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Material Punch
沖型加工
客製化產品
客製化產品規格
膠帶類客製化規格
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
非膠帶產品客製化規格
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |