Products
耐熱UV膠帶
Heat-resistant UV Tape
耐熱UV膠帶
業界在耐溫膠帶多選用PI膠帶(搭配矽膠或壓克力膠)，PI膠帶雖流通度高，如遇被貼物較薄、小、脆時，因無解黏機制(且黏性遇熱後黏性會爬升)，在P&P或下料時較具困難。
因應上述情形，我司開發具耐高溫耐受性之UV膠帶，可普及應用於半導體及各產業高溫製程，且更為便利。
- 可耐溫220~260度
- 於被貼物 wafer / glass / SUS ..等，於高溫後不殘膠
產品結構
產品規格
| Appearance/Surface | Transparent / Flat | ||
| Thickness (without liner) (um) | 60 | ||
| Adhesive strength (N/25 mm) | 25 ℃ / RT | 4.9 / 0.09 (SUS) | |
| 4.8 / 0.08 (GLASS) | |||
| 220 ℃ / 30min | 9.17 / 0.25 (SUS) | ||
| 7.99 / 0.24 (GLASS) | |||
| 260 ℃ / 5min | 8.7 / 0.06 (SUS) | ||
| 7.9 / 0.04 (GLASS) | |||
| **The data is before UV / after UV** | |||
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Dicing Tape
切割膠帶
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Laser Debond Material
雷射解膠膜/液
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Die Attach film/DAF
固晶膜
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Polyimide Tape
耐高溫PI膠帶
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Material Punch
沖型加工
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Low temperature DAF
低溫固晶膜
客製化產品
客製化產品規格
膠帶類客製化規格
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
非膠帶產品客製化規格
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |