Products
研磨膠帶
Grinding Tape
研磨膠帶
研磨膠帶可保護晶圆表面電路，防止在晶圓背面研磨過程中出現損壞或污染。
- 提供UV以及non-UV兩種型式研磨膠帶
- 獨家緩衝中間層設計，對大直徑錫球晶圓有絕佳包覆性，不易造成表面凹陷或翹曲
- 製程結束後容易移除、錫球破損及殘膠機率低
產品結構
產品規格
| UV440 | UV595 | UV170 | |
| Base Film : | PET | PET | PET |
| Base Film Thickness | 75 um | 75 um | 50um |
| Intermediate | 315 | 500 | 100 |
| Adhesive Base: | Acrylic | Acrylic | Acrylic |
| UV Adhesive | 50 | 20 | 20 |
| Total Thickness | 440 | 595 | 170 |
| 180°Peel AF after UV (unit : g/25 mm) on SUS | 30↓ | ||
| 180°Peel AF before UV (unit : g/25 mm) on SUS | 550±100 | 400↓ | 1300±200 |
| Lamination Condition | 65±10℃ @1mins | 65±10℃ @ 1mins | 25±5℃ |
| UV release amount | 360~500mj/cm2 | 250~500mj/cm2 | 360~500mj/cm2 |
其他推薦產品
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Dicing Tape
切割膠帶
-
Laser Debond Material
雷射解膠膜/液
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Die Attach film/DAF
固晶膜
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Polyimide Tape
耐高溫PI膠帶
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Material Punch
沖型加工
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Low temperature DAF
低溫固晶膜
客製化產品
客製化產品規格
膠帶類客製化規格
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
非膠帶產品客製化規格
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |